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Lesson AGCD-07-90 Engineering the via stub
with Eric Bogatin,
Signal Integrity Evengelist
Teledyne LeCroy Front Range Signal Integrity Lab
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AGCD-07-90 Engineering the via stub

  • Mode conversion and location of the return via
  •  Insertion loss with a via stub- transmission line model and 3D full wave model
  •  Higher effective Dk in a via stub due to capacitive loading
  •  Engineering shorter via stubs

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