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Lesson AGCD-07-60 Engineering a transparent via in Simbeor
with Eric Bogatin,
Signal Integrity Evengelist
Teledyne LeCroy Front Range Signal Integrity Lab
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AGCD-07-60 Engineering a transparent via in Simbeor

  • Adjusting the clearance hole and impact on differential impedance
  •  Impact of the via to via pitch on differential impedance
  •  Impact of via stub in 8 layer stack ups
  •  Blind and buried vias to reduce stub length

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